Product Range
- Single Sided Printed Circuit Boards
- Grades – FR1 / CEM1 / CEM3 / FR4 / MCPCB
Board Technologies
The installed capacity is 360000 sq meters per annum
Technical and Production Capability:
Base Material : Copper Clad Laminates
FR1, CEM1/3, FR4 - 1.0mm, 1.60 mm
Aluminum Copper Clad Laminates - 0.80, 1.0mm, 1.60mm, T.C. 1W/m. K, 2W/m. K
Copper Thickness : 18 & 35 Microns
Maximum Board Size
600 mm x 500 mm
Track Width / Spacing
250/ 250 microns
Minimum Hole Size
0.70 mm Punching - 0.40 mm CNC Drill
Circuit Types
SMD Pads, Over Lays, Carbon Pads
Solder Resist
UV Curable White & Green
Surface Finish
OSP, ROHS Flux coating
Laminate Grades Used
Sr. No | Name/ANSI | UL-94 | Thickness | Particulars |
---|---|---|---|---|
1 | XPC | 94HB | 1.60mm with 35μ Cu | Paper Phenolic Laminates |
2 | FR-1 | 94V-0 | 1.60mm with 35μ Cu | Paper Phenolic Laminates |
3 | FR-1 Green | 94V-0 | 1.60mm with 35μ Cu | Paper Phenolic Green Laminates free of Halogen, Antimony, Cadmium |
4 | FR-2 | 94V-0 | 1.60mm with 35μ Cu | Paper Phenolic Laminates |
5 | FR-2 Green | 94V-0 | 1.60mm with 35μ Cu | Paper Phenolic Green Laminates free of Halogen, Antimony, Cadmium |
6 | CEM1 / CEM3 | 94V-0 | 1.00mm / 1.20mm / 1.60mm with 35μ Cu | Composite Epoxy Material |
7 | FR-4 | 94V-0 | 1.00mm / 1.60mm with 35μ Cu | Glass Epoxy Laminates |
8 | MCPCB | 94V-0 | 0.80mm / 1.00mm / 1.60mm with 18μ / 25μ / 35μ Cu | Aluminium Copper Clad Laminate |